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Nichia STS-DA1-0293
SPECIFICATIONS FOR NICHIA CHIP TYPE RED
MODEL : NSSR064T
LED
NICHIA CORPORATION
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Nichia STS-DA1-0293
1.SPECIFICATIONS
(1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature
IFP Conditions :
Symbol IF IFP IR PD Topr Tstg Tj Tsld
and
Absolute Maximum Rating 40 160 85 100 -40 ~ +100 -40 ~ +100 110 Reflow Soldering : 260C Hand Soldering : 350C
Duty 1/10
(Ta=25C) Unit mA mA mA mW C C C for 10sec. for 3sec.
Pulse Width 10msec.
(2) Thermal Characteristics Item Symbol Rja Heat resistance Rjs
Typ. 300 120
(Ta=25C) Unit C/W C/W
Rja = Heat resistance from Dice to Ambient temperature (Ta) Rjs = Heat resistance from Dice to Solder temperature of Cathode Side (Ts) Using Nichia standard circuit board FR4, t=1.6mm, Copper foil, t=35m
(3) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Intensity Iv x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram.
Condition IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA]
Typ. (2.1) (640) 0.700 0.299
(Ta=25C) Max. Unit 2.5 V mcd -
(4) Ranking Item Luminous Intensity Rank T Rank S Rank R Symbol Iv Iv Iv Condition IF=20[mA] IF=20[mA] IF=20[mA] Min. 720 500 360
(Ta=25C) Max. Unit 1000 mcd 720 mcd 500 mcd
Luminous Intensity Measurement allowance is 10%.
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Nichia STS-DA1-0293 Color Rank x y 0.67 0.27 (IF=20mA,Ta=25C) Rank R 0.67 0.73 0.73 0.33 0.33 0.27
Color Coordinates Measurement allowance is 0.01. Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia.
2. INITIAL
OPTICAL/ELECTRICAL
CHARACTERISTICS
Please refer to "CHARACTERISTICS" on the following pages.
3.OUTLINE
DIMENSIONS
AND
MATERIALS
Please refer to "OUTLINE DIMENSIONS" on the following page. Package : Heat-Resistant Polymer Material as follows ; Encapsulating Resin : Silicone Resin (with Diffused) Electrodes : Ag Plating Copper Alloy
4.PACKAGING
* The LEDs are packed in cardboard boxes after taping. Please refer to "TAPING DIMENSIONS" and "PACKING" on the following pages. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT
NUMBER
The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 7 for 2007, 8 for 2008 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Intensity
B for Nov. )
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Nichia STS-DA1-0293
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (using flux, Lead Solder) -40C ~ 100C 1min. (10sec.) 1min. (Pre treatment 30C,70%,168hrs.) -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, Ta=-40C Ta=25C, IF=40mA Ta=85C, IF=30mA 60C, RH=90%, IF=20mA Ta=-40C, IF=20mA JEITA ED-4701 500 501 JEITA ED-4701 400 403 Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25C Dipping Time : 5 min. 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles 75cm R=1.5k, C=100pF Test Voltage=2kV RH=90% Note 2 times Number of Damaged 0/22
1 time over 95% 100 cycles
0/22 0/100
Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking
100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1 time
0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/22
Vibration
48min.
0/10
Drop Electrostatic Discharge JEITA ED-4701 300 304
3 times 3 times Negative/Positive
0/10 0/22
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement Item Forward Voltage Luminous Intensity Condition 1 Luminous Intensity Condition 2 Symbol VF IV IV Test Conditions IF=20mA IF=20mA IF=20mA Min. L.S.L.**) L.S.L.**) 0.7 0.5 Max. U.S.L.*) 1.1
*) U.S.L. : Upper Standard Level
**) L.S.L. : Lower Standard Level
These test items are judged by the criteria of Luminous Intensity Condition 2.
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Nichia STS-DA1-0293
7.CAUTIONS
(1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 5C * This product has silver plated metal parts that are inside and/or outside the package body. The silver plating becomes tarnished when being exposed to an environment which contains corrosive gases. Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics. Please do not expose the LEDs to corrosive atmosphere during storage. * After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur.
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Nichia STS-DA1-0293
(3) Recommended circuit * In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED. It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the absolute maximum rating.
(A)
...
(B)
...
* This product should be operated in forward bias. A driving circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. (4) Heat Generation * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * The operating current should be decided after considering the ambient maximum temperature of LEDs.
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Nichia STS-DA1-0293
(5) Soldering Conditions * The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. * Recommended soldering conditions
Reflow Soldering Lead Solder Pre-heat Pre-heat time Peak temperature Soldering time Condition 10 sec. Max. refer to Temperature - profile 1. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) 120 ~ 150C 120 sec. Max. 240C Max. Lead-free Solder 180 ~ 200C 120 sec. Max. 260C Max. Temperature Soldering time 350C Max. 3 sec. Max. (one time only) Hand Soldering
Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure.
<1 : Lead Solder>
2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max.
Above 200C
<2 : Lead-free Solder>
240C Max. 10sec. Max. 1 ~ 5C / sec. 1 ~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max.
Above 220C
260C Max. 10sec. Max.
2.5 ~ 5C / sec.
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
9.5 4 1.5 1.5 4
Use the following conditions shown in the figure.
2.6
4
(Unit : mm)
: Solder resist
* Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating. * After soldering, do not warp the circuit board.
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Nichia STS-DA1-0293 (6) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (7) Static Electricity * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. (8) Others * NSSR064 complies with RoHS Directive. * The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. * Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. * The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). * User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. * The formal specifications must be exchanged and signed by both parties before large volume purchase begins. * The appearance and specifications of the product may be modified for improvement without notice.
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Nichia STS-DA1-0293
ICI Chromaticity Diagram
0.9
520
0.8
530 510 540 550 560
0.7
0.6
570 500
0.5
580 590
y
0.4
600 610 620 630
0.3
490
R
0.2
480
0.1
0 0
470 460
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
x
Color Coordinates Measurement allowance is 0.01.
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Forward Voltage vs. Forward Current
Forward Current IFP (mA) Relative Luminosity (a.u.) 200 160 100 50 20 10 5 Ta=25C
Forward Current vs. Relative Luminosity
Allowable Forward Current IFP (mA) 9 8 7 6 5 4 3 2 1 0 Ta=25C
Duty Ratio vs. Allowable Forward Current
300 200 160 100 Ta=25C
40 20 10 1 5 10 20 50 100 Duty Ratio (%)
1 1.2
1.7 2.2 2.7 3.2 3.7 Forward Voltage VF (V)
0
50 100 150 200 250 Forward Current IFP (mA)
Ambient Temperature vs. Forward Voltage
3.7 3.2 2.7 2.2 1.7 1.2 -60 -30 0 30 60 90 120 Ambient Temperature Ta (C) Relative Luminosity (a.u.) Forward Voltage VF (V) IFP=60mA IFP=20mA IFP=5mA
Ambient Temperature vs. Relative Luminosity
Allowable Forward Current IF (mA) 2.0 IFP=20mA 1.0
Ambient Temperature vs. Allowable Forward Current
50 40 30 20 12 10 0 0
Ts=Solder Temperature (Cathode Side) Ta=Ambient Temperature
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0.5
0.2 -60 -30 0 30 60 90 120 Ambient Temperature Ta (C)
20 40 60 80 100 120 Temperature T (C)
Nichia STS-DA1-0293
Model
NSSR064
NICHIA CORPORATION
Title No.
CHARACTERISTICS
080616819581
Ambient Temperature vs. Chromaticity Coordinate (D)
Relative Emission Intensity (a.u.)
Spectrum
1.2 1.0 0.8 0.6 0.4 0.2 0 450 500 550 600 650 700 750 Wavelength (nm) Ta=25C IF=20mA
0.33 IFP=20mA 0.32 0.31
-40C(619nm) 0C(623nm) 25C(625nm) 50C(628nm) 100C(631nm)
y
0.30 0.29
0.28 0.68 0.69 0.70 0.71 0.72 0.73
x Ambient Temperature vs. Dominant Wavelength
Dominant Wavelength D (nm) Dominant Wavelength D (nm)
Forward Current vs. Dominant Wavelength
631 629 627 625 623 621 619 1 5 10 20 50 100 200 Forward Current IFP (mA)
Relative Luminosity (a.u.)
Directivity
1.0 0 Ta=25C IFP=20mA 10 20 30 40 50 0.5 60 70 80 0 90 60 30 Radiation Angle 0 0.5 90 1.0
637 633 629 625 621 617 613 -60 -30 0 30 60 90 120 Ambient Temperature Ta (C) IFP=20mA
Ta=25C
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Nichia STS-DA1-0293
Model
NSSR064
NICHIA CORPORATION
Title No.
CHARACTERISTICS
080616819591
(2.4) Internal Circuit A Protection device
0.8 0.3
Anode
K 2.8 (0.4)
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0.8 0.3
Cathode mark (C 0.6)
3.5 0.3
(2.4)
(1.9)
3.2
Cathode
MATERIALS Heat-Resistant Polymer Silicone Resin (Diffused) Ag Plating Copper Alloy
ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES
2 0.3
(0.8)
Note) NxSx064 has a protection device built in as a protection circuit against static electricity.
Rev.1 Section Approve Check Draw
(0.45)
(1.05) 2.2
Rev.2 Rev.3 Rev.4
ST
Date Model Title No.
Unit mm 15/1 Scale Allow
Nichia STS-DA1-0293
Jun. 16, 2008
NxSx064
NICHIA CORPORATION
OUTLINE DIMENSIONS 0.2
STSZ-H816172
1.750.1
Taping part
1.5+0.1 -0 40.1 20.05
0.250.05
Reel part
180+0 -3
11.41 90.3
3.50.05
Cathode mark
8+0.3 - 0.1
3.650.1
(2.75)
13
0.2
40.1
2.850.1
2.150.1 1+0.25 -0
Label
XXXX LED
TYPE NxSx064xT LOT xxxxxxQTY pcs RoHS
Reel End of tape
No LEDs
LEDs mounting part
No LEDs
60+1 -0
2 1 0.8
-12Embossed carrier tape Reel Lead Min.160mm (No LEDs)
Reel Lead Min.100mm (No LEDs)
Pull direction
Top cover tape
Reel Lead Min.400mm
Nichia STS-DA1-0293
2,000pcs/Reel Model
Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes.
NxSx064xT
Unit mm Scale Allow
NICHIA CORPORATION
Title No.
TAPING DIMENSIONS
080510816181
Nichia STS-DA1-0293 The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed.
Reel Label Seal
TYPE LOT QTY
NICHIA
XXXX LED
NxSx064xT xxxxxxPCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
RoHS
Moisture absorbent material
Moisture proof foil bag
The box is partitioned with the cardboard. Label
NICHIA
Nichia
LED
XXXX LED
TYPE RANK QTY NxSx064xT PCS RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 2,000 MAX. Reel/box 7reel MAX. 15reel MAX. 30reel MAX. Quantity/box (pcs) 14,000 MAX. 30,000 MAX. 60,000 MAX.
Dimensions (mm) 291 237 120 8t 259 247 243 5t 444 262 259 8t
Model
NxSx064xT
NICHIA CORPORATION
Title No.
PACKING
070802651612
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